半导体与集成电路产业是代表未来的重要引擎性、支撑性、标志性蓝海产业。随着全球数字化转型的加速，半导体与集成电路产业的重要性日益凸显，浙江省半导体与集成电路产业现已建立起涵盖设计、材料、装备、制造、封装测试等环节的完整产业链，形成了以杭、绍、甬、嘉为核心的环杭州湾模拟芯片与功率器件特色产业集群和以湖、金、衢、丽为核心的半导体材料支撑产业集群。作为国家集成电路产业设计的重要基地，杭州市政府高度重视集成电路产业的发展，先后出台了《杭州市进一步鼓励集成电路产业加快发展的专项政策》、《关于促进集成电路产业高质量发展的实施意见》以及《关于推动经济高质量发展的若干政策》财政补贴、税收优惠、人才引进和平台建设一系列专项政策发展，提出打造长三角集成电路核心城市，会同宁波市、绍兴市、嘉兴市协同打造环杭州湾集成电路核心产业集聚区。到2025年，杭州集成电路产业规模实现800亿元、冲刺1000亿元，年均增长20%的目标，在产业生态建设方面，杭州构建起覆盖“芯片设计-基础材料-集成电路制造-规模化应用” 的完整产业链，集聚上下游产业形成以晶圆制造为核心的产业集群，在设计制造、化合物半导体、半导体核心材料、关键设备及零部件等领域培育一批“专精特新”中小企业，其产品广泛服务于消费电子、工业控制、汽车电子等多个领域，为行业发展提供了重要力量。

参展咨询：13795333699  张老师

• IC设计/芯片与应用：IC及相关电子产品设计、EDA、AI算力芯片、存储芯片、汽车芯片、智能家电芯片、人工智能芯片及物联网、人工智能、汽车电子、智慧城市、智能终端、健康医疗等产品；

IC Design / Chips and Applications: IC and related electronic product design, EDA, AI computing power chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products in the fields of the Internet of Things (IoT), AI, automotive electronics, smart cities, smart terminals, healthcare, etc.

• IC制造：半导体晶圆制造、半导体封装与测试技术及产品；

IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging, and testing technologies and products, etc.

• 先进封装：倒装、凸点、晶圆级封装、2.5D/3D先进封装(TSV及TGV))、扇出型晶圆级封装等设计、材料、测试、设备等；

Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), fan-out wafer-level packaging, as well as related design, materials, testing, and equipment, etc.

• 晶圆设备/封测设备：晶圆加工过程中所需的各种精密设备及半导体封装设备、半导体测试设备、IC测试仪器、先进封装工艺（如SiP、3D封装）设备、功率器件设备等；

Wafer Equipment / Packaging and Testing Equipment: Precision equipment and semiconductor packaging equipment required for wafer processing, semiconductor testing equipment, IC testing instruments, equipment for advanced packaging processes (such as SiP and 3D packaging), and power device equipment, etc.

• 化合物半导体及功率器件：化合物半导体材料（如GaN、SiC等）及其相关产品，包括功率器件、射频器件及上游设备、材料等；

Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, as well as upstream equipment and materials, etc.

• 半导体材料：单晶硅、硅片及硅基材料、抛光垫、掩膜版、溅射靶材、抛光液、刻蚀溶液、陶瓷封装材料、键合丝、引线框架、封装基板、光刻胶、薄膜沉积材料、特种气体、超纯水、塑封材料、高性能塑料等；

Semiconductor Materials: Monocrystalline silicon, wafers and silicon-based materials, polishing pads, photomasks, sputtering targets, polishing slurries, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.

• 半导体核心零部件：机器视觉、传感器、密封圈、精密轴承、金属零部件、Valve阀、硅/SiC件、Robots、石英件、过滤器、射频电源、陶瓷件、ESC静电吸盘、压力Gauge、泵、MFC流量计、步进马达、运动控制、伺服电机、直线模组、无尘拖链、封装模具、制冷设备、感应加热器等；

Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC components, robots, quartz components, filters, RF power supplies, ceramic components, ESC electrostatic chucks, pressure gauges, pumps, MFC flow controllers, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, cooling equipment, induction heaters, etc.

• AI算力：AI芯片、服务器、交换器、电源、液冷温控等；

AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, etc.

• 配套设施与服务：支持产品/无尘室、一般商业服务/咨询、销售及服务、标准与其他。

Supporting Facilities and Services: Product support/cleanrooms, general business services/consulting, sales and services, standards, etc.